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 [1. Current Research]    “Research Outline (Enumeration of Current Projects)”

(1) Research Interests “Focal area of investigation is spherical AlN filler, semiconductor package, composite particle”

1. INTRODUCTION

[1.4 Need to understand the SiO₂ filler primary property, and to develop a new packaging technology]

 

A cause of the lack of understanding was presumably a deficiency of appropriate observation method of this material system having the liquid typed-matrix of epoxy resin.  Observing directly the SiO₂ internal particle-aggregated structures must be promising to consolidate the scientific foundation.  Thus far, that was very few, although some polymeric materials without silica filler, having much rather solidified matrix, were investigated with transmission microscopy.  Our previous papers were described the principle of transparent microscopy using the photo-elasticity of resin polymer covered around SiO₂ agglomerates, which locally provided a stress toward the resin distributed in the surrounding areas, and structured the rearrangement of polymer molecules.  Also concerned its validity to clarify the particle-size distribution or coupling treatment influence on rheological property.